Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Su-Tsai Lu0
Date of Patent
July 3, 2007
0Patent Application Number
110476460
Date Filed
February 2, 2005
0Patent Primary Examiner
Patent abstract
A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second substrate whose surfaces have a second bonding layer and electrodes. The first bonding layer is combined with the second bonding layer, and the metal pads are in electrical communications with the electrodes. The second substrate may be a flexible substrate to decrease the strain between the first substrate and the second substrate.
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