Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 3, 2007
Patent Application Number
10795496
Date Filed
March 8, 2004
Patent Primary Examiner
Patent abstract
A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat generated by electronics components in the pluggable electronics module is conducted to the heat sink through a thermal path defined by the thermal plate, the compressible thermal pad, and the clip.
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