Patent 7239523 was granted and assigned to Ciena (company) on July, 2007 by the United States Patent and Trademark Office.
A modular electronic assembly includes a chassis, a housing supported by the chassis having an access opening through a first wall of the housing, a removable access panel or releasable member at least partially covering the opening, and a midplane supported by the chassis and slidably removable from the chassis through the opening when the housing is mounted on the chassis. A method of constructing a modular electronic assembly is also disclosed.