Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ka Shing Kwan0
Rong Duan0
Wei Hong He0
Date of Patent
July 10, 2007
0Patent Application Number
108945140
Date Filed
July 19, 2004
0Patent Primary Examiner
Patent abstract
A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to a part of the electronic device to be worked upon. A support structure is attachable for coupling it to a periphery of the opening whereby the support structure is extended across the opening for supporting the part of the electronic device that is accessible through the opening.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.