Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 10, 2007
Patent Application Number
10935790
Date Filed
September 8, 2004
Patent Primary Examiner
Patent abstract
A mold kit and mold which provides for renewal of damaged or worn molds. The mold kit employs spacers to make up for subtractive reconditioning of the mold. A method for renewing the mold is also disclosed.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
