Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 10, 2007
Patent Application Number
10670587
Date Filed
September 25, 2003
Patent Primary Examiner
Patent abstract
The polishing fluid is useful for polishing tantalum-containing barrier materials of a semiconductor substrate. The polishing fluid includes a nitrogen-containing compound having at least two nitrogen atoms comprising imine compounds and hydrazine compounds. The nitrogen-containing compound is free of electron-withdrawing substituents; and the polishing fluid is capable of removing the tantalum-containing barrier materials from a surface of the semiconductor substrate without an abrasive.
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