Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 10, 2007
Patent Application Number
11139223
Date Filed
May 27, 2005
Patent Primary Examiner
Patent abstract
Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.
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