US Patent 7242099 Chip package with multiple chips connected by bumps
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Patent abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
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US Patent 07242099 Chip package with multiple chips connected by bumps US Patent 7242099 Chip package with multiple chips connected by bumps
Infobox
Patent Number
0724209900
Patent Number
724209900
Edits on 18 May, 2023
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Official Website
Edits on 29 Apr, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
072420990
Date of Patent
July 10, 2007
0Patent Application Number
106956300
Date Filed
October 27, 2003
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072420990
Date of Patent
July 10, 2007
0Patent Application Number
106956300
Date Filed
October 27, 2003
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
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Edits on 21 Nov, 2021
Golden AI
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US Patent 07242099 Chip package with multiple chips connected by bumps
Infobox
Is a
Patent jurisdiction
Patent number
07242099
Date of patent
July 10, 2007
Patent application number
10695630
Date Filed
October 27, 2003
Patent primary examiner
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