Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 17, 2007
Patent Application Number
10497233
Date Filed
November 28, 2002
Patent Primary Examiner
Patent abstract
A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an average particle size of 0.1 to 1 μm. This copper alloy powder has a higher starting temperature for sintering, higher oxidation resistance and better heat resistance than a copper powder.
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