Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Goro Nakatani0
Date of Patent
July 17, 2007
Patent Application Number
10761081
Date Filed
January 20, 2004
Patent Primary Examiner
Patent abstract
There are included a semiconductor substrate provided with a desirable element region, an electrode pad formed to come in contact with a surface of the semiconductor substrate or a wiring layer provided on the surface of the semiconductor substrate, a bonding pad formed on a surface of the electrode pad through an intermediate layer, and a resin insulating film for covering a peripheral edge of the bonding pad such that an interface of the bonding pad and the intermediate layer is not exposed to a side wall.
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