Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Charles W. C. Lin0
Date of Patent
July 17, 2007
0Patent Application Number
108945930
Date Filed
July 20, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint contacts and electrically connects the pillar and the ground plane, and the ground plane is electrically connected to the pad.
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