US Patent 7245500 Ball grid array package with stepped stiffener layer
Patent 7245500 was granted and assigned to Broadcom (company) on July, 2007 by the United States Patent and Trademark Office.
Is a
Date Filed
October 31, 2002
Date of Patent
July 17, 2007
Patent Application Number
10284371
Patent Citations Received
Patent Inventor Names
Sam Ziqun Zhao
0
Reza-ur Rahman Khan
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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