Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 24, 2007
Patent Application Number
10981557
Date Filed
November 5, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device comprises a frame provided on a substrate to form a semiconductor-chip accommodating part on the substrate. A semiconductor chip is provided in the semiconductor-chip accommodating part. An organic insulating layer is provided to cover the semiconductor chip and the frame. A wiring layer is provided on the organic insulating layer. In the semiconductor device, the frame comprises gaps which are arranged in a longitudinal direction of the frame.
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