Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomonori Tanoue0
Masami Ohnishi0
Hidetoshi Matsumoto0
Date of Patent
July 24, 2007
Patent Application Number
10830049
Date Filed
April 23, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A radio frequency power amplifier module that brings sufficient attenuation to a radio frequency signal in a bias supply line connecting a bias control part and a radio frequency power amplifier part without increasing module substrate area is aimed. At least one bonding pad 106 having a capacitance component to a ground and stitch structure inductances 108, 109 composed of a bonding wire 105 provided via the bonding pad are provided in the bias supply line connecting the bias control part and the radio frequency power amplifier part.
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