Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazuyuki Kato0
Satoru Kobayashi0
Date of Patent
July 24, 2007
Patent Application Number
10883032
Date Filed
July 2, 2004
Patent Primary Examiner
Patent abstract
In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weight being tin, or further containing 0.01 to 0.5 percent by weight of aluminum are inserted into the interior of the electrodes before pressing the electrodes into the ends of the substrate of the fuse, the exterior of the electrodes is heated to melt the solder chips, thereby connecting between the electrodes and the fuse wire.
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