Patent attributes
In the head portion, the thermopile is arranged substantially in the center of the head portion. The preamplifier board is arranged near the thermopile. The heat diffusion member made of a high heat conductive material is arranged so as to surround the thermopile and the preamplifier board. The main board and the laser diode are arranged between the upper surface of the head casing and the upper surface of the heat diffusion member. The power supply board and the laser diode are arranged between the down surface of the head casing and the down surface of the heat diffusion member. The thermopile, the preamplifier board, the main board, the power supply board, and the laser diodes are arranged out of contact with the heat diffusion member.