US Patent 7252218 Bipolar plate fabrication by roll bonding
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Patent abstract
An anti-bonding material is placed in a desired pattern onto a first sheet of conductive material. A second sheet of conductive material is roll bonded with the first sheet of material. Fluid is injected between the bonded first and second sheets of material to expand the sheets of material at the desired pattern. A flow channel is formed at the desired pattern between the first and second sheet during fluid injection.
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Golden AI
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Patent Jurisdiction
Patent Number
72522180
Date of Patent
August 7, 2007
0Patent Application Number
107384020
Date Filed
December 17, 2003
0Patent Primary Examiner
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Official Website
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US Patent 07252218 Bipolar plate fabrication by roll bonding US Patent 7252218 Bipolar plate fabrication by roll bonding
Infobox
Patent Number
0725221800
Patent Number
725221800
Edits on 2 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072522180
Date of Patent
August 7, 2007
0Patent Application Number
107384020
Date Filed
December 17, 2003
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072522180
Date of Patent
August 7, 2007
0Patent Application Number
107384020
Date Filed
December 17, 2003
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
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Infobox (+1 properties)
Infobox
Website URL
Edits on 22 Nov, 2021
Golden AI
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US Patent 07252218 Bipolar plate fabrication by roll bonding
Infobox
Is a
Patent jurisdiction
Patent number
07252218
Date of patent
August 7, 2007
Patent application number
10738402
Date Filed
December 17, 2003
Patent primary examiner
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