Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 7, 2007
Patent Application Number
10869657
Date Filed
June 16, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention provides a chemical mechanical polishing pad comprising a window formed in the polishing pad, the window having a void provided on a side thereof. The polishing pad further comprises a void-pressure relief channel provided in the polishing pad from the void to a periphery of the polishing pad.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.