Patent attributes
In a semiconductor package, a semiconductor chip is mounted on a wiring board or package board. A lid member defines a recess for accommodating the semiconductor chip, and is mounted on the package board so that the semiconductor chip is accommodated in the recess of the lid member. A first adhesive layer is formed on the package board so that a peripheral portion of the lid member is adhered on the package board with the first adhesive layer. A second adhesive layer is formed on the semiconductor chip so that a central portion of the lid member is adhered to the semiconductor chip with the second adhesive layer. The following relationship is established:25 μm≦h−d≦300 μm where: “d” is a depth of the recess of the lid member; and “h” is a sum of a thickness of the semiconductor chip and a thickness of the second adhesive layer.
