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US Patent 7258161 Cooling system for densely packed electronic components
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Patent
1
Date Filed
January 16, 2004
1
Date of Patent
August 21, 2007
1
Patent Application Number
10759708
1
Patent Citations Received
US Patent 11943904 Hybrid thermosyphon with immersion cooled evaporator
2
US Patent 11702271 Vacuum insulated articles with reflective material enhancement
3
US Patent 11751930 Cryoablation element with conductive liner
US Patent 11883085 Endovascular near critical fluid based cryoablation catheter and related methods
4
US Patent 11904312 Microfluidic devices with lid for loading fluid
5
Patent Inventor Names
Michael R. Cosley
1
Richard L. Fischer
1
Patent Jurisdiction
United States Patent and Trademark Office
1
Patent Number
7258161
1
Patent Primary Examiner
Tho Duong
1
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