Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jung Joo Kim0
Date of Patent
August 21, 2007
0Patent Application Number
110269180
Date Filed
December 30, 2004
0Patent Primary Examiner
Patent abstract
A method for forming an Al interconnect is disclosed. A disclosed method comprises: depositing a Ti layer on a substrate having predetermined devices; depositing a TiN layer on the entire surface of the Ti layer by performing a CVD process; performing a plasma treatment for the TiN layer; depositing an Al layer on the TiN layer; and forming an ARC on the entire surface of the Al layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
