Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zhihai Wang0
Hong Lin0
Shiqun Gu0
Wai Lo0
Wei-Jen Hsia0
Wilbur G. Catabay0
Date of Patent
August 21, 2007
0Patent Application Number
114195480
Date Filed
May 22, 2006
0Patent Primary Examiner
Patent abstract
An improvement to a method of forming an integrated circuit. An etch stop layer is formed to overlie the front end processing layers of the integrated circuit. Support structures are formed that are disposed so as to support electrically conductive interconnects on various levels of the integrated circuit. Substantially all of the non electrically conductive layers above the etch stop layer that were formed during the fabrication of the interconnects are removed.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
