Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 21, 2007
Patent Application Number
11108385
Date Filed
April 18, 2005
Patent Primary Examiner
Patent abstract
In one embodiment, a first integrated circuit (IC) chip may comprise one or more bonding pads to which bonding wires from respective external leads may be connected. Other bonding wires connect the same bonding pads on the first IC chip to a second IC chip. This can be used, for example, to reduce the need for connections integral to the first IC chip for routing the signals received over the bonding wires internally in the first IC chip to the second IC chip.
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