US Patent 7261230 Wirebonding insulated wire and capillary therefor
Patent 7261230 was granted and assigned to Freescale Semiconductor on August, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 29, 2003
0
Date of Patent
August 28, 2007
0
Patent Application Number
10652434
0
Patent Inventor Names
Soo San Yong
0
Chiaw Mong Chan
0
Fuaida Harun
0
Kong Bee Tiu
0
Lan Chu Tan
0
Lau Teck Beng
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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