US Patent 7261776 Deposition of buffer layers on textured metal surfaces
Patent 7261776 was granted and assigned to American Superconductor Corporation on August, 2007 by the United States Patent and Trademark Office.
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Patent abstract
A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
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US Patent 07261776 Deposition of buffer layers on textured metal surfaces US Patent 7261776 Deposition of buffer layers on textured metal surfaces
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Patent Number
0726177600
Patent Number
726177600
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
072617760
Date of Patent
August 28, 2007
0Patent Application Number
108126760
Date Filed
March 30, 2004
0Official Website
Patent Primary Examiner
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072617760
Date of Patent
August 28, 2007
0Patent Application Number
108126760
Date Filed
March 30, 2004
0Official Website
Patent Primary Examiner
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US Patent 07261776 Deposition of buffer layers on textured metal surfaces
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07261776
Date of patent
August 28, 2007
Patent application number
10812676
Date Filed
March 30, 2004
Patent primary examiner
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