Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Ping Feng0
Yuh-Da Fan0
Hsi-Kuei Cheng0
Steven Lin0
Min-Yuan Cheng0
Huang-Yi Huang0
Date of Patent
August 28, 2007
0Patent Application Number
108305770
Date Filed
April 23, 2004
0Patent Primary Examiner
Patent abstract
A method for monitoring copper film quality and for evaluating the annealing efficiency of a copper annealing process includes measuring hardness of a copper film formed on a substrate before and after annealing and comparing the hardness measurement results. The measurements can be correlated to grain boundary saturation levels, copper grain sizes and therefore conductivity. Hardness measurements may be taken at a plurality of locations throughout the substrate to account for variations in the copper film grain structure.
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