US Patent 7262121 Integrated circuit and methods of redistributing bondpad locations
Patent 7262121 was granted and assigned to Micron Technology on August, 2007 by the United States Patent and Trademark Office.
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Integrated circuits and methods of redistributing bondpad locations are disclosed. In one implementation, a method of redistributing a bondpad location of an integrated circuit includes providing an integrated circuit comprising an inner lead bondpad. A first insulative passivation layer is formed over the integrated circuit. A bondpad-redistribution line is formed over the first insulative passivation layer and in electrical connection with the inner lead bondpad through the first insulative passivation layer. The bondpad-redistribution line includes an outer lead bondpad area. A second insulative passivation layer is formed over the integrated circuit and the bondpad-redistribution line. The second insulative passivation layer is formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the bondpad-redistribution line. Other aspects and implementations are contemplated.
US Patent 07262121 Integrated circuit and methods of redistributing bondpad locations US Patent 7262121 Integrated circuit and methods of redistributing bondpad locations
US Patent 07262121 Integrated circuit and methods of redistributing bondpad locations
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