Patent attributes
According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.
