Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 28, 2007
Patent Application Number
11075094
Date Filed
March 8, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.
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