US Patent 7262632 Signal measurement systems and methods

Systems and methods are disclosed for measuring signals on an integrated circuit die. In one embodiment, a reference signal is distributed to die locations proximal to the signals to be measured. The reference signal is transmitted over transport paths coupling each of the signals to be measured to the die output. The signals to be measured are transmitted over their respective transport paths and measured at the die output. The relative delay between the signals can be calculated using the reference signal measurements.