Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 28, 2007
Patent Application Number
11128364
Date Filed
May 13, 2005
Patent Primary Examiner
Patent abstract
A method for polishing a thin film formed on a substrate includes planarizing a thin film formed on a reference substrate by a CMP process such that the thin film remains on the reference substrate. After the planarizing, the thin film is cleaned, and then values of Δ and Ψ with respect to the cleaned thin film are measured by ellipsometry. A physical property of the thin film is determined based on the Δ and Ψ which have been measured by ellipsometry, and a polishing condition for an other substrate having a thin film to be polished is set based on physical property data which are obtained by the determining of the physical property.
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