Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jung-Hsiang Cheng0
Date of Patent
August 28, 2007
0Patent Application Number
112643420
Date Filed
October 28, 2005
0Patent Primary Examiner
Patent abstract
A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin module. Blades are installed inside the fan housing. The fan includes inlets on an upper surface and a lower surface of the fan housing and a outlet on a side surface of the fan housing, so as to absorb heat through the inlet and eliminate the heat through the outlet. Therefore, the heat dissipating efficiency is improved.
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