Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 28, 2007
Patent Application Number
10127657
Date Filed
April 23, 2002
Patent Citations Received
Patent Primary Examiner
Patent abstract
An infrared data communication module includes a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted. A resin package is formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element. A shield member is formed within the resin package for covering the IC element to prevent light-attributable noises from reaching the IC element.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
