US Patent 7265566 Semiconductor component arrangement having a temperature-based defect identification

A semiconductor component arrangement includes a semiconductor body, at least a first power semiconductor switching element, and a defect identification circuit. The semiconductor body has a front side and a rear side, and the first power semiconductor switching element is integrated therein. The defect identification circuit is integrated in the semiconductor body, and is displaced at a distance from the first semiconductor switching element. The defect identification circuit includes a temperature sensor and an evaluation circuit, the evaluation circuit coupled to the temperature sensor and configured to generate a defect signal in the event of a sensed temperature indicative of the presence of a defect in the at least one semiconductor switching element. The evaluation circuit has a second semiconductor switching element and a drive circuit therefore.