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US Patent 7265964 Multilayer feedthrough capacitor array

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Is a
Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
72659640
Patent Inventor Names
Masaaki Togashi0
Date of Patent
September 4, 2007
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Patent Application Number
115980550
Date Filed
November 13, 2006
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Patent Citations Received
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US Patent 11664165 Multilayer capacitor having open mode electrode configuration and flexible terminations
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US Patent 11664169 Multilayer ceramic capacitor having ultra-broadband performance
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US Patent 11705280 Multilayer capacitor having open mode electrode configuration and flexible terminations
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US Patent 11676763 Multilayer ceramic capacitor having ultra-broadband performance
0
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US Patent 11984262 Multilayer ceramic capacitor having ultra-broadband performance
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US Patent 11984268 Multilayer ceramic capacitor having ultra-broadband performance
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US Patent 11887784 Multilayer ceramic capacitor having ultra-broadband performance
0
Patent Primary Examiner
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Eric Thomas
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Patent abstract

A multilayer feedthrough capacitor array is provided with a capacitor element, and first to sixth terminal electrodes. The capacitor element has a plurality of laminated insulator layers, a first signal internal electrode and a first ground internal electrode disposed so as to face each other with the insulator layer in between, and a second signal internal electrode and a second ground internal electrode disposed so as to face each other with the insulator layer in between. The first signal internal electrode includes a first signal lead portion electrically and physically connected to the first terminal electrode, and a second signal lead portion electrically and physically connected to the second terminal electrode. The first ground internal electrode includes a first ground lead portion electrically and physically connected to the fifth terminal electrode, and a second ground lead portion electrically and physically connected to the sixth terminal electrode. The second signal internal electrode includes a third signal lead portion electrically and physically connected to the third terminal electrode, and a fourth signal lead portion electrically and physically connected to the fourth terminal electrode. The second ground internal electrode includes a third ground lead portion electrically and physically connected to the fifth terminal electrode, and a fourth ground lead portion electrically and physically connected to the sixth terminal electrode. The first signal internal electrode and the second ground internal electrode are disposed so as not to face each other with the insulator layer in between, and the second signal internal electrode and the first ground internal electrode are disposed so as not to face each other with the insulator layer in between.

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