Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheng-Ping Lee0
Date of Patent
September 4, 2007
0Patent Application Number
111728120
Date Filed
July 5, 2005
0Patent Primary Examiner
Patent abstract
A power supply with heat sink is mounted inside a computer, and includes a support, a circuit board arranged on a surface of the support, and a heat sink provided on another surface of the support. The support defines a slot substantially therein. A plurality of electronic components and a plurality of thermal components are respectively provided on opposite surfaces of the circuit board. The thermal components are evenly attached to the heat sink. The heat sink conducts and dissipates heat generated by the thermal components, thereby reducing noise and cooling large area. The power supply with heat sink is assembled flexibly for saving space.
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