US Patent 7265993 Dispersive interconnect system for EMI reduction

An interconnect system between an integrated circuit device and a printed circuit board may include a filter portion coupled to conductors on a power distribution bus. The filter portion may reduce radiated emissions produced during operation of the integrated circuit. The interconnect may include dispersive elements. The dispersive elements may be less electrically conductive of current in a higher frequency range than in a lower frequency range. In some embodiments, the second level interconnect may include a socket having dispersive contacts. The contacts may be coupled to core power conductors on the power distribution bus.