US Patent 7267320 Mold apparatus
Patent 7267320 was granted and assigned to Samsung on September, 2007 by the United States Patent and Trademark Office.
All edits
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+494 characters)
Article
Patent abstract
A mold apparatus having at least a pair of molds formed with a cavity, at least one pipe accommodator formed in the molds, at least one heat pipe mounted in the pipe accommodator, a heat-cool source part connected to the heat pipe the heat and cool the heat pipe, and a controller to control the heat-cool source part to selectively heat and cool the heat pipe. Thus a mold apparatus to reduce a molding cycle and improve the quality of a molded product's appearance is provided.
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07267320 Mold apparatus US Patent 7267320 Mold apparatus
Infobox
Patent Number
0726732000
Patent Number
726732000
Edits on 23 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072673200
Date of Patent
September 11, 2007
0Patent Application Number
111422320
Date Filed
June 2, 2005
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072673200
Date of Patent
September 11, 2007
0Patent Application Number
111422320
Date Filed
June 2, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 22 Nov, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07267320 Mold apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07267320
Date of patent
September 11, 2007
Patent application number
11142232
Date Filed
June 2, 2005
Patent primary examiner
Find more entities like US Patent 7267320 Mold apparatus
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
