US Patent 7267713 Conductive paste and glass circuit structure

Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit having a composition containing a Bi2O3—B2O3—SiO2—Al2O3 or Bi2O3—B2O3—SiO2—Al2O3—ZnO primary component and about 0.5 to 5% by weight of NiO as a secondary component, and an organic vehicle. The conductive paste is applied on a glass substrate and then baked to form a conductor film. A glass circuit structure formed by using the conductor film can be advantageously used as a defogging glass for an automobile window.