US Patent 7267878 Hot-melt adhesive in particulate form

A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced bya.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture,b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture,c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies,d.) removing the cooled hot-melt-adhesive granulate,e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture.These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.