A stencil mask has a silicon thin film in which an opening pattern is formed, a silicon oxide film, and a support part. The silicon thin film has a two-layer structure of a first silicon thin film and a second silicon thin film stacked one on top of the other. The first and second silicon thin films enable microscopic openings to be made in them. Stacking the first and second silicon thin films one on top of the other makes it possible to achieve the necessary strength and increase the strength of the stencil mask.