Patent attributes
A low inductance mount for decoupling capacitors. In one embodiment, a circuit carrier such as a printed circuit board (PCB) includes a surface layer, a first layer adjacent to the surface layer, and a second layer adjacent to the first layer. A conductive region is implemented on the surface layer, and is electrically coupled to a first circuit plane in the first layer. At least one mounting pad is located on the surface layer of the PCB within the conductive region. The mounting pad is electrically isolated from the remainder of the conductive region and is electrically coupled to a second circuit plane in the second layer. A capacitor is mounted on the PCB, wherein a first terminal of the capacitor is coupled to the conductive region and a second terminal is coupled to the mounting pad.
