Patent attributes
In a capacitive semiconductor sensor, a sensor chip and a circuit chip are contained in a package. First bump members are mounted on second electrodes disposed on a second surface of the circuit chip, respectively. The sensor chip is mounted at its first surface on the second surface of the circuit chip so that first electrodes disposed on the first surface of the sensor chip are electrically mechanically connected to the second electrodes through the first bump members, respectively. Second bump members are mounted on third electrodes disposed on the second surface of the circuit chip, respectively. The third electrodes are electrically mechanically connected to lead electrodes disposed to the package through the second bump members, respectively.
