Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Julia S. Svirchevski0
Katrina A. Mikhaylich0
Date of Patent
September 18, 2007
0Patent Application Number
112562930
Date Filed
October 21, 2005
0Patent Primary Examiner
Patent abstract
In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and the pad surface is rinsed so as to substantially remove by-product produced by the chemicals. A mechanical conditioning operation is performed on the surface of the pad. The wafer surface includes copper and oxide during the CMP operation.
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