Patent attributes
A package-ready light-sensitive integrated circuit and process for preparing a light-sensitive semiconductor substrate for packaging that provide for a reduced exposure of a light-sensitive integrated circuit to light. The package-ready light-sensitive integrated circuit includes a semiconductor substrate (e.g., a silicon wafer) with an upper surface and a lower surface and lateral edges, an individual light-sensitive integrated circuit formed in and on the upper surface of the semiconductor substrate, and an opaque material layer covering the lower surface and lateral edges of the semiconductor substrate. The opaque material layer prevents light from entering the semiconductor substrate and interfering with operation of the light-sensitive integrated circuit. The process includes first providing at least one semiconductor substrate with a plurality of light-sensitive integrated circuits formed in and on its upper surface. Next, the semiconductor substrate(s) is diced to form individual light-sensitive integrated circuits, each of which has a semiconductor substrate lower surface and semiconductor substrate lateral edges. The individual light-sensitive integrated circuits are then transferred into a magazine and their semiconductor substrate lower surface and semiconductor substrate lateral edges covered (for example by injection molding) with an opaque material (e.g., an opaque molding compound or opaque epoxy) to form an opaque material layer thereon, thereby forming coated light-sensitive integrated circuits. The coated light-sensitive integrated circuits are then removed from the magazine.
