Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiromitsu Miyai0
Kevin Shawn Petrarca0
Richard Paul Volant0
Samuel Roy McKnight0
Takashi Hisada0
Wolfgang Sauter0
Adreanne Kelly0
Caitlin W. Weinstein0
...
Date of Patent
September 25, 2007
Patent Application Number
11030496
Date Filed
January 6, 2005
Patent Primary Examiner
Patent abstract
Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
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