Patent attributes
A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional element via the first wiring; a through-hole interconnection that is electrically connected to the pad and is provided in a hole that is defined penetrating the semiconductor base material from the first side thereof to the second side thereof, the through-hole interconnection including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material provided surrounding the functional element; a second substrate that is bonded to a first side of the first substrate via the sealing material.
