Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yukihiro Satou0
Masahide Okamoto0
Osamu Ikeda0
Date of Patent
September 25, 2007
0Patent Application Number
112720630
Date Filed
November 14, 2005
0Patent Primary Examiner
Patent abstract
In a semiconductor module connecting a semiconductor element and a passive element to a printed board, each of connection portions between the semiconductor element and the printed board and between the passive element and the printed board includes a metal with a melting point of 260° C. or higher and an intermetallic compound with a melting point of 260° C. or higher. Specifically, by connecting them using Pb-free solder with a melting point of 260° C. or lower, the printed board capable of lowering in cost, lightening, and reducing back height can be applied to a module board.
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