Patent attributes
Spin-coating apparatus for use in manufacturing a semiconductor device includes a spin-chuck for rotating a wafer or the like, and a baffle plate disposed under the spin chuck to collect and discharge residue spun off of the wafer as the wafer is rotated by the spin chuck. The inner periphery of the baffle plate and a portion of a clamping plate adjacent the inner periphery of the baffle plate are configured to prevent the baffle plate from moving up relative to the clamping plate. Also, an outer peripheral surface of the clamping plate and a portion of the baffle plate adjacent the outer peripheral edge of the clamping plate may be configured as a guide to seat the baffle plate on the clamping plate and prevent the baffle plate from moving laterally relative to the clamping plate.
