Patent attributes
A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
